According to Market Statsville Group (MSG), the global silicon-on-insulator market size is expected to grow from $1,110.1 million in 2021 to $5,946.2 million by 2030, at a CAGR of 20.5% from 2022 to 2030 multi-industry solution that helps reduce power and heat while increasing the speed and performance of a device. Using SOI achieves a 30% faster processing speed than conventional metal oxide semiconductors along with 80% reduced power consumption. It is widely recognized as a new solution for high voltage and RF components and offers a wide range of applications in MEMS, power devices, pressure sensors, and CMOS IC manufacturing.
Increasing smartphone penetration and growing demand for high-performance, low-power devices are the key factors driving the growth of the silicon on insulators market. The silicon-on-insulator market is anticipated to grow due to the various benefits the technology offers, such as enabling continued miniaturization, better radiation tolerance, improvement in bulk technology, and the capability of higher current densities.
In addition, the increasing demand for silicon in insulators from manufacturing industries such as automotive, consumer electronics, and military and defense drives market growth. Key players are mainly investing in product innovation and R&D driving the demand for silicon over insulators in the forecast period.
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Definition of the global market for silicon on insulators
Silicon on Insulator (SOI) consists of a single layer of crystalline silicon separated from the bulk substrate by a thin insulating layer. They are commonly used in advanced complementary metal-oxide semiconductors and microelectromechanical systems (MEMS).
Global Silicon-on-Insulators Market Dynamics Drivers: The various benefits offered by the FD-SOI ecosystem are increasing the adoption of the technology for a wide range of applications Fully Depleted Silicon-On-Insulator (FD-SOI) is a planar process technology that offers the benefits of reduced silicon geometries while simplifying the manufacturing process. This technology offers a superior trade-off of power and performance. FD-SOI has the potential to combine low loss, low crosstalk, and high linearity components with high switching frequency capabilities, as they are associated with a high resistivity base substrate. This enables new system-on-chip (SoC) RF devices for the next generation of wireless communication by integrating front-end components such as switches, power amplifiers, and low-noise amplifiers with high-performance mmWave transceivers and digital blocks. Besides, the ability to step down the supply voltage, although not necessarily as low as 0.4V, can be difficult in applications where power is more of a challenge than performance. Since dynamic power scales with Vdd², FD-SOI’s ability to use a much lower supply voltage presents a unique advantage. All of these attributes make FD-SOI a vital technology for a wide range of applications.
Constraints: High Cost of SOI Wafers Holding Back Silicon Market Growth in Insulators Although SOI significantly improves the performance of the chips produced, an SOI wafer costs around four to five times between US$400 and US$500, more expensive than a bulk wafer, around US$100. Complex production techniques such as double pattern and more sophisticated and expensive production tools are the main reasons for the high cost of SOI wafers. The higher cost of the SOI wafer compared to a silicon wafer is one of the main reasons why Intel and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) rejected the FD-SOI approach in favor of FinFET. Therefore, the high cost of SOI wafers is hampering the growth of the market. Nevertheless,
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Scope of the global silicon on insulator market The study categorizes the silicon on insulator market based on wafer size, wafer type, technology, product, application and region.
By Wafer Size Outlook (Sales/Revenue, $M, 2017-2030) 200mm 300mm Outlook By Wafer Type (Sales/Revenue, $M, 2017-2030) RF-SOI FD-SOI PD- SOI Power- SOI Emerging SOI By Technology Outlook (Sales/Revenue, USDM, 2017-2030) Smart Cut Bonding SOI Layer Transfer SOI Outlook by Product (Sales/Revenue, USDM, 2017-2030) RF FEM Products MEMS Devices Power Products Optical Communication Image Sensing By Application Perspective (Sales/Revenue, USDM, 2017-2030) Consumer Electronics Automotive Telecoms and Datacoms Industrial Military, Defense and Aerospace Outlook by Region (Sales/Revenue, USDM, 2017-2030) North America US Canada Mexico Europe Germany Italy France United Kingdom Spain Poland Russia The Netherlands Norway Republic Czech Rest of Europe Asia Pacific Porcelain Japan India South Korea Indonesia M
alaysia Thailand Singapore Australia and New Zealand Rest of Asia Pacific South America Brazil Argentina Colombia Rest of South America Middle East and Africa Saudi Arabia United Arab Emirates South Africa North Africa Rest of MEA The 200mm segment represents the largest market share, by size wafer In terms of wafer size, the global market for silicon in insulators is segmented into 200mm and 300mm. The 200mm segment between wafer size generated the highest revenue in the global silicon on insulator market. In 2021, 200mm had a market share of 60.9%. More 200mm wafers are produced than any other diameter worldwide. Today, more than 70% of ICs in end-user devices are manufactured on a 200mm wafer. Core memory and microprocessor technologies have moved to 300mm, while ancillary device technologies have stayed on the 200mm wafer node.
Wafers of this size are used for various applications including test and calibration equipment and the devices used in the cell phone or flat panel television. The growing end-use industries for the 200mm silicon wafer are the main driver of the 200mm wafer size segment in the global silicon in insulator market. According to GSMA Intelligence, there are about 5.19 billion unique mobile phone users in the world as of January 2020. The number of unique mobile phone users worldwide increased by 124 million in the last 12 months. This growth in the mobile phone industry contributes to the growth of the 200mm wafer size segment of the market.
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Asia Pacific represents the highest CAGR during the forecast period
Across geographies, the silicon on insulator market is segmented into North America, Asia-Pacific, Europe, South America, and the Middle East & Africa. Globally, Asia Pacific is anticipated to have the highest CAGR of 21.5% in the global Silicon in Insulator market during the forecast period. The Chinese government initiative like ‘Made In China 2025’ is about to invest a staggering USD 150 billion. This is a strategic move to build high-end precision manufacturing capabilities, with semiconductors being the priority segments. Such a move would boost the market for silicon in insulators in a positive way.
North America is the fastest growing region, after Asia Pacific during the study period. The United States has one of the largest auto markets in the world. The automotive industry is also at the forefront of innovation. According to Auto Alliance, of the $105 billion spent on R&D globally, almost $18 billion is spent in the United States. The growing automotive industry in the United States is finally driving the market for silicon in insulators.
Key Players of Global Silicon On Insulator Semiconductors Market NXP Shin-Etsu Chemical Co., Ltd. Soitec Global Wafers Co., Ltd. tower semiconductors ltd. Magnachip Semiconductor Corporation Murata Manufacturing Company, Ltd. Shanghai Simgui Technology Co., Ltd. STMicroelectronics NV Sumco Corporation
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